A little about polishes and applying pressure..

A

a.k.a. Patrick

New member
An interesting topic brought up on another forum, I thought I would get some different opinions.

When I use a UDM or similiar machine, I use very little added pressure when polishing (I assume its just a few lbs, as I've never attempted running a UDM on a scale). I want complete control of the machine, this being vibration (within reason, as vibrations can be somewhat subdued with force), lateral movement, horizontal reasoning (pad levelness to surface).

We all know abrasives perform best when they roll out or abrade themseleves to a finer degree. Very often, we start with more and/or larger abrasives that are not capable of finishing, thus requiring additional smaller abrasives and polishing. My main question here is, do you think polishes are designed to be used with added pressure? Or is the design of the machines head weight and the users added manipulation forces usually suffice for adequate performance of most polishes?

:think:
 
Good question. Took you a while to get there but still good.;)



I vary the pressure that I use with both the DA and rotary. For me it depends on the the machine, pad, product and finish. In my experience with the DA you can tell if you use too little or too much pressure as micromarring is the result. The rotary just seems to be more or less aggressive.
 
Although not an expert I have to say that generally I do not add much pressure with my PC. There have been times when I have applied a lot of pressure(motor pulling way down) to try and get more abrading action on things such as a heavy scratch. Most times this has not been effective so I had to resort to the rotary to get more action on the area effected.
 
I may be in the minority here but many times I use a great deal of pressure. Especially with 106ff and my rotory. I find that slow speeds with alot of pressure break down the 106 better so it ends up looking like melted butter. The results are awesome when I polish this way. However, on the flip side I find that SIP works better with higher speeds and lighter pressure. I guess it all depends on which polish I'm using. Try doing a small area with a foam pad via rotory and use alot of pressure at slow speed with 106ff and you'll see what I mean.



Patrick
 
With a DA, I typically use a good deal of pressure for the first couple of passes over the area, then ease up to moderate pressure for most of the working time, then finish with just the weight of the machine on the last couple of passes.



Tort
 
When attempting significant correction via PC I apply as much pressure as I can before the machine bogs unless I'm using 4" pads (with 4" pads I apply less pressure as per some lessons learned the hard way).



With the Cyclo, which I can't bog, I apply pretty much for significant correction, never had problems.



For lighter polishing with the PC or Cyclo, I usually apply minimal pressure and let the product to the work.



With the rotary I seldom apply much pressure.
 
My main question here is, do you think polishes are designed to be used with added pressure? Or is the design of the machines head weight and the users added manipulation forces usually suffice for adequate performance of most polishes?
Click to expand...

I think everyone is missing my point though.
 
a.k.a. Patrick said:
I think everyone is missing my point though.
Click to expand...





OOPS :o yeah, we did....



a.k.a. Patrick said:
My main question here is, do you think polishes are designed to be used with added pressure? Or is the design of the machines head weight and the users added manipulation forces usually suffice for adequate performance of most polishes?
Click to expand...
 
i'm very new to machine polishing (pc only)but in my experience the polishes react or start to work with heat build up between the pad and the paint. adding pressure increases heat so i guess ime pressure leads to heat build up and then leads to the polish breaking down and doing it's job.



:waxing:
 
Does the PC generate enough heat to actually make a difference though?

Ive always been able to break down polishes, e.i. Optimum, FS, 1Z, PB's etc without adding a lot of pressure. On another note, Ive never melted any BP's or pads, nor even noticed any significant heat buildup on the pad. The PC body? yes, but not the pads. Ive got that PC so hot I couldnt hold it......
 
a.k.a. Patrick said:
Does the PC generate enough heat to actually make a difference though?
Click to expand...



4" pads can get pretty warm, but I dunno if it's break-down-product-hot. Heh heh, you could always get something like PI-III Extra Cut RC 05936 and see, but I wouldn't try it on anything you care about ;)
 
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