With the PC you'll be better off using a cutting pad like a LC VC orange or yellow pad. You should spread the polish at 3 and then crank the PC up to 5.5 or 6 and continue until there is a light haze left; the polish will dust too. As for the marring there is a good chance that if you use the DACP with a cutting pads you will be left with some micro marring but that comes from any decently aggressive polish. Take care of the marring left behind with some #80, Menzerna FPII, or SSR 1 by using a polishing pad on the PC.