Creating a mid-level cut

alexxxx89

alexxxx89

New member
Hey everyone,

I've run into a bit of a pickle; not a bad one, just inconvenient.

I have low cut polishes and I have aggressive compounds, but nothing in between. I have SF4500 and D301, then I have D300 and UC. According to the Autopia Polish Chart, they are on polar opposite sides. It's time to work on the hard-to-detect-but-definitely-there swirls/micro marring on my Bright White GCV.

Will a Tangerine hydro tech pad with SF remove more MM than D301 and the MF Finishing pad? I'm asking bc the last go-round of D301 didn't give me the results I wanted (I can still find marks with regular light). I'd also like to seal with KSG instead of topping with 845.

Thoughts?


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What machine are you using, what size pads, and what is your experience level in years with this set up ?
Dan F
 
Using a Meg's G11V2 (Dying to get a rupes; this vibration is killing me), 5" pads, and I've been using it for about 2 years. I'd consider myself an intermediate hobbyist.


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Use a lighter polish with a more aggressive pad or a more aggressive polish with a less aggressive pad.
 
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