Hey everyone,
I`ve run into a bit of a pickle; not a bad one, just inconvenient.
I have low cut polishes and I have aggressive compounds, but nothing in between. I have SF4500 and D301, then I have D300 and UC. According to the Autopia Polish Chart, they are on polar opposite sides. It`s time to work on the hard-to-detect-but-definitely-there swirls/micro marring on my Bright White GCV.
Will a Tangerine hydro tech pad with SF remove more MM than D301 and the MF Finishing pad? I`m asking bc the last go-round of D301 didn`t give me the results I wanted (I can still find marks with regular light). I`d also like to seal with KSG instead of topping with 845.
Thoughts?
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