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I use the rotary like a floor buffer, using the up/down tilting of the handle to control direction. Also I use the slower speeds on the rotary, It still cuts aggressively, but doesnt introduce added friction and heat. As the polish breaks down, I use ISA (alcohol) to keep the product fron drying out too much, this gives me enhanced work-time, and doesnt load up my pad, as the polish breaks down, I wind up with a dusty residue.... also, I dont have to go to a finer product In particular, IP on my light finish seems to work down to a fine cut polish after I have sprayed the pad with ISA and let the polish do its thing. When I started, I used to burn the paint occasionally using pressure. Now, I use a moderate speed and the weight of the buffer only. And I keep the thing moving at all times !
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Great Preparation is what really turns heads ! !
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